发明名称 SUBSTRATE TRANSFER DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a transfer device which relaxes positional precision of a hand part when a substrate is sucked and held with a Bernoulli chuck, for efficient transfer of a substrate in non-contact state at a high speed. SOLUTION: The hand part of parallel mechanism is provided with a Bernoulli chuck which sucks and holds a substrate in non-contact state, and a plurality of regulation pins arranged in such manner as surround the Bernoulli chuck. An introducing axis part, being tapered to decrease diameter as advances downward, is provided to the lower end of the regulation pin formed in round rod. A regulating axis part which receives the periphery of substrate to regulate skidding is provided to the middle part in vertical direction of the regulation pin including the introducing axis part. The introducing axis part can also work as the regulating axis part. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011060849(A) 申请公布日期 2011.03.24
申请号 JP20090206181 申请日期 2009.09.07
申请人 MURATA MACHINERY LTD 发明人 MURAYAMA TAKAHIKO;NAKANISHI HIDEAKI;MAEDA AKIRA
分类号 H01L21/677;B65G49/07 主分类号 H01L21/677
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