| 摘要 |
PROBLEM TO BE SOLVED: To provide a piezoelectric device and manufacturing method thereof in which a crystal vibrating-reed and a package can be bonded by bumps by efficiently irradiating the bump with a laser beam. SOLUTION: A piezoelectric device 100A includes a tuning-fork type piezoelectric vibrating-reed 100A and a base 22; the tuning-fork type piezoelectric vibrating-reed is constituted of a piezoelectric material, having a pair of vibrating arms 13 having exciting electrodes 20 and extending from a base portion 18; and a pair of support arms 15 having connecting electrodes 12a, 12b conducted with the exciting electrodes 20 and extending from the base 18 outside both the vibrating arms 13. The base part has a pair of bumps formed on one side; and while the connecting electrodes 12a, 12b of the pair of supporting arms 15 are placed on the pair of bumps, the bumps are irradiated with a laser beam, thereby melting the bumps and thereafter, the bumps are cured; and the support arms are fixed on the base. COPYRIGHT: (C)2011,JPO&INPIT |
