| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid-state image pickup device which can protect the interior of a package by simple assembling without using a sealing resin. SOLUTION: The solid-state image pickup device includes a package having a recessed portion and an inner lead, a solid-state image pickup element having an electrode pad and being mounted on the recessed portion of the package, a transparent plate stuck on the pixel surface of the solid-state image pickup element, a wire connecting the inner lead and the electrode pad, and a cover covering the upper part of the wire by exposing the region of the transparent plate corresponding to the pixel surface, while being engaged by at least one of the package and the transparent plate. COPYRIGHT: (C)2011,JPO&INPIT
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