| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring substrate which allows fabrication by a simple process with good adhesion between a resin substrate and a circuit, suppresses transmission loss in a high frequency band when used as a high-frequency antenna, and has a hole that enables precise etching due to the fact that a copper layer forming a circuit is thin. SOLUTION: The manufacturing method for the wiring substrate includes a process to form a hole 2 in a resin substrate 1 with a surface roughness (Rz) of less than 5μm (preferably no more than 1μm), a process to perform reform treatment on the surface of the resin substrate 1 using ozone water, a process to make copper plating on the surface of the resin substrate 1 after the reform treatment of the surface, and a process to perform etching treatment of the copper plated layer based on the predetermined pattern. COPYRIGHT: (C)2011,JPO&INPIT |
