发明名称 |
Lead pin for package substrate |
摘要 |
There is provided a lead pin for a package substrate including: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.
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申请公布号 |
US2011068473(A1) |
申请公布日期 |
2011.03.24 |
申请号 |
US20100805559 |
申请日期 |
2010.08.05 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE KI TAEK;OH HUENG JAE;JEONG SUNG WON;LEE GI SUB;CHOI JIN WON |
分类号 |
H01L23/498;H01B5/00 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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