发明名称 PATTERN FORMING METHOD
摘要 Disclosed is a pattern forming method having a first step of forming a first ultraviolet curable resin layer on a substrate, a second step of leading a pattern-formed surface of a first mold wherein a predetermined pattern is formed to oppose the first ultraviolet curable resin layer, and attaching the substrate to the first mold by applying pressure, and a third step of irradiating diffused ultraviolet rays on the first ultraviolet curable resin layer, to which the pattern of the first mold is transferred by the pressure-attaching, the irradiated ultraviolet rays being diffused by disposing an ultraviolet light diffusion member between the ultraviolet curable resin layer and an ultraviolet light source.
申请公布号 US2011070462(A1) 申请公布日期 2011.03.24
申请号 US20090992493 申请日期 2009.05.14
申请人 SHOWA DENKO K.K. 发明人 UCHIDA HIROSHI;FUKUSHIMA MASATO;SAKATA YUKO
分类号 B29C35/08;G11B5/62 主分类号 B29C35/08
代理机构 代理人
主权项
地址