| 摘要 |
The semiconductor component chip (1) has an insulation layer at rear end, which is formed to electrically insulate semiconductor component chip from a base body, on which the semiconductor component chip is arranged. The base body is a substrate or a lead frame (2). The insulation layer is an amorphous carbon-hydrogen-silicon-oxygen layer. An independent claim is also included for the method of production of a semiconductor component chip. |
