发明名称 PROTECTION AGAINST HEAT CASE
摘要 PURPOSE: A heat radiating case for an LED lamp module is provided to transfer heat generated in a chip LED to a metallic case, thereby increasing heat radiating efficiency. CONSTITUTION: A chip LED(11) is installed on a substrate(10). The substrate includes a receiving groove(2), heat radiating fins(3), and a metallic case(1). A bending unit(5) is closely attached to both ends of the chip LED. A finishing cap(20) is inserted into both openings of the case. A long groove(4) is formed among heat radiating fins. The finishing cap includes a side plate(21), a cover unit(22), and an insertion protrusion unit(23).
申请公布号 KR20110030730(A) 申请公布日期 2011.03.24
申请号 KR20090088290 申请日期 2009.09.18
申请人 O, IL DONG;RYU, JEONG HA 发明人 O, IL DONG;RYU, JEONG HA
分类号 F21V29/00;F21S2/00;F21V17/00 主分类号 F21V29/00
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