| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a pattern formation method and a pattern formation device such that when two coating patterns crossing each other are formed, at least one of the coating patterns is a thick film (with a high aspect ratio) and unevenness of a surface of a crossing part thereof is suppressed. <P>SOLUTION: In a second coating process of forming a finger wiring pattern crossing a bus wiring pattern on a substrate by linearly supplying paste onto a principal surface of a substrate and the bus wiring pattern from a nozzle, curing processing for curing the coating liquid is carried out on the paste supplied onto the principal surface of the substrate (step S54), and light irradiation of the paste supplied onto the bus wiring pattern is stopped (step S52). <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
