| 摘要 |
PROBLEM TO BE SOLVED: To provide a paste film forming apparatus capable of measuring thickness of a paste film with an inexpensive configuration and reducing execution costs of a formation process of the paste film, and to provide an electronic component packaging device, a method of forming the paste film, and a method of packaging electronic components. SOLUTION: After a measurement tool 50 is lowered from above a table 13 where a paste film Pm is formed and a leg 52 of the measurement tool 50 is grounded to an upper surface 13s of the table 13, imaging is performed from a lower part of the measurement tool 50 pulled from the paste film Pm, and a thickness (t) of the paste film Pm formed on the table 13 is calculated, based on a region where paste Pst has been adhered on a lower surface of a measurement unit 53 (measurement pieces 53a, 53b, to 53e) in an obtained image. COPYRIGHT: (C)2011,JPO&INPIT
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