UPPER LAYER FILM FORMING COMPOSITION AND METHOD FOR FORMING PHOTORESIST PATTERN
摘要
<p>Disclosed is an upper layer film forming composition which is used for the purpose of forming an upper layer film on a photoresist film so as to cover the photoresist film. The upper layer film forming composition contains (A) a resin that is soluble in a developer solution and (B) a solvent component that contains 1-15% by mass of (B1) a solvent that has a boiling point of 180-280°C at 101.3 kPa and a vapor pressure of 0.001-0.1 kPa at 20°C.</p>
