| 摘要 |
<p>Disclosed is a method for manufacturing a wiring board wherein generation of a contact failure is eliminated. The method is provided for manufacturing the wiring board (1) which has: an Al alloy pad (3) on a base layer (2); a gate insulating film (4) and an interlayer insulating film (5) on an Al alloy pad (3); and a contact hole having the opening thereof reaching a part of the Al alloy pad (3). A contact hole (7) is formed in the gate insulating film (4) and the interlayer insulating film (5) by dry etching, such that at least a part (20) of the end portion of the Al alloy pad and a portion (10) adjacent to at least the part (20) of the end portion, said portion being on the base layer (2), are exposed. A nonconducting layer (9) on the surface of the Al alloy pad (3), said nonconducting layer being generated due to the dry etching, is removed after the contact hole (7) is formed.</p> |
