| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a process which prepares stabilized metal nanoparticles suitable for the formation of the conductive element of an electronic device. <P>SOLUTION: The process for preparing stabilized metal nanoparticles comprises a step of reacting a metal compound with a reducing agent in the presence of a stabilizer in a reaction mixture comprising the metal compound, the reducing agent and the stabilizer, wherein the reaction mixture is substantially free of solvent, to form a plurality of metal-containing nanoparticles during the solvent-free reduction process with molecules of the stabilizer on the surface of the metal-containing nanoparticles. <P>COPYRIGHT: (C)2011,JPO&INPIT |
