| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device capable of reducing a warp of a wiring board while keeping productivity and inexpensiveness. <P>SOLUTION: The method of manufacturing a semiconductor device includes: a step of forming a warp suppressing member 31 on a first surface 20 of the wiring board 1 having a plurality of chip mounting regions 1a partitioned by dicing lines 30; a step of individually mounting semiconductor chips 41 on the respective chip mounting regions 1a of a second surface 10 opposite to the first surface 20 of the wiring board 1; a step of resin-sealing the semiconductor chips 41 together to form a sealing resin layer 51 on the second surface 10 of the wiring board 1; and a step of cutting the wiring board 1 along the dicing lines 30 so as to divide into a plurality of semiconductor devices 2 each containing the semiconductor chip 41. The step of forming the warp suppressing member 31 includes a step of forming the warp suppressing member 31 on the first surface 10 of the wiring board 1 so that stress occurring on the wiring board 1 during the step of forming the sealing resin layer 51 is substantially zero. <P>COPYRIGHT: (C)2011,JPO&INPIT |
