METHOD FOR ELECTROLESS NICKEL-PALLADIUM-GOLD PLATING, PLATED PRODUCT, PRINTED WIRING BOARD, INTERPOSER AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an electroless nickel-palladium-gold plating method which enables prevention of abnormal metal deposition on a resin surface being an undercoat when performing such plating on a plating target surface such as terminals of a printed wiring board, terminals of other electronic components or other resin substrates with a fine metal pattern to obtain a high-quality plated surface, and also to provide a plated product with a high-quality plated surface, particularly such as an interposer, motherboard or semiconductor device using the same.

SOLUTION: There is provided a method for performing the electroless nickel-palladium-gold plating of a substrate with the fine metal pattern on plating target objects such as terminals of a printed wiring board. At least one surface treatment selected from a treatment with a solution of pH 10 to 14 and a plasma treatment is performed at an optional step after the step of providing a palladium catalyst and before the step of performing electroless palladium plating.

COPYRIGHT: (C)2011,JPO&INPIT