| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a prepreg which responds to trend to a thin film and also adjusts the amount of a resin according to a circuit pattern, and to provide a substrate having the prepreg and a semiconductor device. <P>SOLUTION: The prepreg 10 includes a fiber base material 1 structured by a glass fiber, a first resin layer 21 positioning on one surface side of the fiber base material 1, and a second resin layer 22 positioning on the other surface side of the fiber material 1. The first resin layer 21 and the second resin layer 22 are structured with a resin material 2, the compositions of which are the same or different. When the thickness of the first resin layer 21 is defined as B1 and the thickness of the second resin layer 22 as B2, 0<B2/B1<1 is satisfied. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
