发明名称 LOW MOISTURE-ABSORPTIVE POLYAMIDE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a polyamide composition excellent in rigidity, heat resistance, a high melting point, flowability, toughness, and a low moisture-absorption property, and further excellent in mold releasability at molding. SOLUTION: The polyamide composition contains (A) a polyamide obtained by polymerizing (a) a dicarboxylic acid containing at least 50 mol% of an aliphatic dicarboxylic acid with (b) a diamine containing at least 50 mol% of a diamine having a substituent branched from the main chain, and (B) a liquid crystal polyester. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011057976(A) 申请公布日期 2011.03.24
申请号 JP20100178870 申请日期 2010.08.09
申请人 ASAHI KASEI CHEMICALS CORP 发明人 TERADA KAZUNORI;KURIHARA TETSUO
分类号 C08L77/06;C08G69/26;C08K3/00;C08K7/04;C08L67/00 主分类号 C08L77/06
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