发明名称 |
Semiconductor Device and Method of Forming Interposer with Opening to Contain Semiconductor Die |
摘要 |
A semiconductor device has an interposer mounted over a carrier. The interposer includes TSV formed either prior to or after mounting to the carrier. An opening is formed in the interposer. The interposer can have two-level stepped portions with a first vertical conduction path through a first stepped portion and second vertical conduction path through a second stepped portion. A first and second semiconductor die are mounted over the interposer. The second die is disposed within the opening of the interposer. A discrete semiconductor component can be mounted over the interposer. A conductive via can be formed through the second die or encapsulant. An encapsulant is deposited over the first and second die and interposer. A portion of the interposer can be removed to that the encapsulant forms around a side of the semiconductor device. An interconnect structure is formed over the interposer and second die.
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申请公布号 |
US2011068459(A1) |
申请公布日期 |
2011.03.24 |
申请号 |
US20100714190 |
申请日期 |
2010.02.26 |
申请人 |
STATS CHIPPAC, LTD. |
发明人 |
PAGAILA REZA A.;LIN YAOJIAN;KOO JUN MO;CHI HEEJO |
分类号 |
H01L23/52;H01L21/56;H01L21/60 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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地址 |
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