发明名称 CONDUCTIVE PASTE, AND WIRING BOARD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a conductive paste of low resistance, excellent in printability, and adhesion to a substrate. SOLUTION: The conductive paste is to be composed of metal particles with at least two kinds of average primary particle sizes, that is, metal powder ingredients consisting of metal particles 1 with a particle size of less than 50 nm, and metal particles 2 with that of 100 nm or more. The paste, with resin and a dispersion medium added, is to have properties showing a metal ratio of 95% or more when it is made into a metal thin film. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011060519(A) 申请公布日期 2011.03.24
申请号 JP20090207473 申请日期 2009.09.08
申请人 DOWA ELECTRONICS MATERIALS CO LTD 发明人 KANEDA HIDEJI
分类号 H01B1/22;H01B1/00;H05K3/12 主分类号 H01B1/22
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