| 摘要 |
In a resin-sealed semiconductor device, an inner lead including a bend portion formed by lifting has a protruding shape located on one side and an inclined vertical surface shape located on the other side (inside) in an external connection terminal direction. A cutaway portion is provided along the bend portion and an external connection terminal. A height of an upper surface portion of the inner lead is higher than a height of an upper surface of a semiconductor element. The inner lead is provided in a substantially central portion of a die pad so that the inclined vertical surface shape is parallel to a side of a die pad which includes a thin portion located in a side surface portion and an exposure portion located on a bottom surface.
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