发明名称 Solder preform and a process for its manufacture
摘要 A mixed mother alloy is prepared from a solder mixture comprising a pyrolyzable flux and high melting point metal particles, the mixed mother alloy is charged into a large amount of molten solder and stirred, and a billet is prepared. The billet can then be extruded, rolled, and punched to form a pellet or a washer, for example.
申请公布号 US2011068149(A1) 申请公布日期 2011.03.24
申请号 US20100923319 申请日期 2010.09.14
申请人 SENJU METAL INDUSTRY CO., LTD. 发明人 HIRANO NAOHIKO;TANAHASHI AKIRA;SAKAMOTO YOSHITSUGU;TSURUTA KAICHI;ISHII TAKASHI;SOGA SATOSHI
分类号 B23K35/14 主分类号 B23K35/14
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