WIRE BONDING APPARATUS AND METHOD

摘要

PURPOSE: An apparatus and a method for bonding a wire are provided to improve the rate of operation of a wire bonding apparatus by continuously bonding a wire and removing the contamination in the end of a capillary. CONSTITUTION: A controller confirms whether the number of wire bonding processes are a preset number or more(S102). The controller inputs a wire(S104). The controller corrects the bending of the wire after the contamination in the end of the capillary is removed(S106). If the bending of the wire is completely corrected, the controller supplies the wire(S107). The controller performs a spark process(S108). The controller obtains a discharge current or image of an initial ball and determines whether a bonding process is possible(S109).