发明名称 ELECTROLESS Cu PLATING LIQUID, ELECTROLESS Cu PLATING METHOD, AND CNT DISPERSANT INTO ELECTROLESS Cu PLATING LIQUID
摘要 PROBLEM TO BE SOLVED: To provide an electroless Cu plating liquid which satisfactorily takes a CNT (carbon nanotube) into a plating film. SOLUTION: The electroless Cu plating liquid includes: the CNT; and a dispersant dispersing the CNT and composed of sodium dodecyl sulfate and hydroxypropyl cellulose. The addition amounts of the sodium dodecyl sulfate and hydroxypropyl cellulose are suitably controlled to about 1.0×10-3M to 2.0×10-3M, respectively. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011058061(A) 申请公布日期 2011.03.24
申请号 JP20090209998 申请日期 2009.09.11
申请人 SHINSHU UNIV 发明人 ARAI SUSUMU;KANAZAWA DAISHI
分类号 C23C18/52 主分类号 C23C18/52
代理机构 代理人
主权项
地址