发明名称 |
ELECTROLESS Cu PLATING LIQUID, ELECTROLESS Cu PLATING METHOD, AND CNT DISPERSANT INTO ELECTROLESS Cu PLATING LIQUID |
摘要 |
PROBLEM TO BE SOLVED: To provide an electroless Cu plating liquid which satisfactorily takes a CNT (carbon nanotube) into a plating film. SOLUTION: The electroless Cu plating liquid includes: the CNT; and a dispersant dispersing the CNT and composed of sodium dodecyl sulfate and hydroxypropyl cellulose. The addition amounts of the sodium dodecyl sulfate and hydroxypropyl cellulose are suitably controlled to about 1.0×10-3M to 2.0×10-3M, respectively. COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2011058061(A) |
申请公布日期 |
2011.03.24 |
申请号 |
JP20090209998 |
申请日期 |
2009.09.11 |
申请人 |
SHINSHU UNIV |
发明人 |
ARAI SUSUMU;KANAZAWA DAISHI |
分类号 |
C23C18/52 |
主分类号 |
C23C18/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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