| 摘要 |
<p>A semiconductor package having a support chip and a fabrication method thereof. The semiconductor package includes a circuit substrate having a conductive pattern on the top surface. A first semiconductor die is attached on top of the circuit substrate. A second semiconductor die is attached on top of the first semiconductor die. Each of the first and second semiconductor dies has a plurality of bond pads on the top surface. A support chip is attached on top of the first semiconductor die and has a plurality of bond pads provided on the top surface. The conductive wires electrically connect the first semiconductor die and the second semiconductor die to the circuit substrate, the second semiconductor die to the support chip, the bond pads of the support chip to each other, and the support chip to the circuit substrate. An encapsulant encloses, as in a capsule, the foregoing components.</p> |
