发明名称 RESIN COMPOSITION FOR PREPARING OF REVERSAL IMPRINT MOLD, AND REVERSAL IMPRINT METHOD USING THE MOLD
摘要 PURPOSE: A resin composition for preparing a reversal imprint mold is provided to ensure excellent durability of nano patterns, to facilitate the manufacture of a reversal imprint mold with a high resolution of 50nm or less, and to increase a transcription rate of a polymer resin thin film or pattern due to uniform contact with a substrate. CONSTITUTION: A resin composition for preparing a reversal imprint mold includes 10 ~ 30 weight% of a photoreactive polymer, 60 ~ 90 weight% of a photoreactive monomer, and 1 ~ 10 weight% of photoinitiator, wherein the viscosity of the reversal imprint mold is 5 ~ 1000 cp. The resin composition further includes 1 ~ 50 parts by weight of release agent based on 100 parts by weight of the sum of three kinds of components.
申请公布号 KR20110030740(A) 申请公布日期 2011.03.24
申请号 KR20090088302 申请日期 2009.09.18
申请人 KOREA INSTITUTE OF MACHINERY & MATERIALS 发明人 CHOI, DAE GEUN;LEE, KI JOONG;JEONG, JUN HO;CHOI, JUN HYUK;KIM, KI DON;LEE, JI HYE
分类号 C08L83/06;B29C45/14;B41M1/00;C08L33/06 主分类号 C08L83/06
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