发明名称 |
RESIN COMPOSITION FOR PREPARING OF REVERSAL IMPRINT MOLD, AND REVERSAL IMPRINT METHOD USING THE MOLD |
摘要 |
PURPOSE: A resin composition for preparing a reversal imprint mold is provided to ensure excellent durability of nano patterns, to facilitate the manufacture of a reversal imprint mold with a high resolution of 50nm or less, and to increase a transcription rate of a polymer resin thin film or pattern due to uniform contact with a substrate. CONSTITUTION: A resin composition for preparing a reversal imprint mold includes 10 ~ 30 weight% of a photoreactive polymer, 60 ~ 90 weight% of a photoreactive monomer, and 1 ~ 10 weight% of photoinitiator, wherein the viscosity of the reversal imprint mold is 5 ~ 1000 cp. The resin composition further includes 1 ~ 50 parts by weight of release agent based on 100 parts by weight of the sum of three kinds of components.
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申请公布号 |
KR20110030740(A) |
申请公布日期 |
2011.03.24 |
申请号 |
KR20090088302 |
申请日期 |
2009.09.18 |
申请人 |
KOREA INSTITUTE OF MACHINERY & MATERIALS |
发明人 |
CHOI, DAE GEUN;LEE, KI JOONG;JEONG, JUN HO;CHOI, JUN HYUK;KIM, KI DON;LEE, JI HYE |
分类号 |
C08L83/06;B29C45/14;B41M1/00;C08L33/06 |
主分类号 |
C08L83/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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