| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing the occurrence of a crack on an insulating substrate of a package with a simple structure. SOLUTION: The semiconductor device includes a package having a ceramic substrate 32 with a semiconductor element mounted thereon, and a metal base plate 31 with the ceramic substrate 32 joined to a main plane 31a. On a side face side of the ceramic substrate 32, an inclined plane 32c is formed which has a distance to the main plane 31a of the metal base plate 31 gradually increased toward the outside from an edge in contact with the metal base plate 31, and an angle formed by the inclined plane 32c and the main plane 31a of the metal base plate 31 is acute. COPYRIGHT: (C)2011,JPO&INPIT
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