SUBSTRATE PROCESSING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus including a substrate conveyance function correcting positional displacement of a wafer in an FOUP (Front Opening Unified Pod) loaded in a semiconductor manufacturing apparatus only by altering a conveyance method without providing an expensive device mechanism. SOLUTION: The substrate processing apparatus includes: a processing chamber processing a substrate; a vacuum conveyance chamber including a first conveyance means conveying the substrate from a preliminary chamber to the processing chamber; an atmospheric conveyance chamber including a second conveyance means conveying the substrate from a carrier to the preliminary chamber; and a control means for controlling the first conveyance means and the second conveyance means. When the substrate in the carrier is taken out, the control means controls the second conveyance means to take out the substrate after positioning the substrate. COPYRIGHT: (C)2011,JPO&INPIT