| 摘要 |
PROBLEM TO BE SOLVED: To provide an annealing apparatus and method that obtain a desired temperature distribution of a semiconductor substrate in annealing. SOLUTION: The annealing apparatus 1 includes: a top lamp 22 that is arranged on a first area 201 above a wafer 4 and corresponding to the wafer 4; a first and second lateral lamps 24, 26 that are arranged in a second area 202 located around the first area 201; and control unit 8 for controlling the top lamp 22, and the first and second lateral lamps 24, 26 to emit light at different timings. COPYRIGHT: (C)2011,JPO&INPIT
|
