发明名称 BOARD SURFACE MOUNTING STRUCTURE OF CONNECTOR
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a board surface mounting structure of a connector capable of carrying out superb reflow soldering and easy mounting on a board. <P>SOLUTION: If a connecting part 12 gives rise to a flexure, or if the connecting part 12 is bent in an upward slant, the connecting part 12 is in a floating state against a pattern 19 with cream solder 20. If it is passed through a reflow furnace in such a state, the solder melts down to be trapped inside a terminal-mounting groove part 14, so that even the connecting part 12 in a bent state can be immersed in it to have soldering 23 completed. Even with the connecting part 12 in the bent state, the pattern 19 and the connecting part 12 are superbly connected. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011060479(A) 申请公布日期 2011.03.24
申请号 JP20090206697 申请日期 2009.09.08
申请人 YAZAKI CORP 发明人 OSADA AKIHIRO
分类号 H01R12/53;H01R12/71;H01R12/77;H05K1/02 主分类号 H01R12/53
代理机构 代理人
主权项
地址