| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer protective film-forming sheet capable of forming a protective film excellent in flatness and cutting characteristics, and exhibiting no generation of colore unevenness after curing; and to provide an adhesive composition to achieve such a protective film and sheet. SOLUTION: The adhesive composition comprises (A) a phenoxy resin, (B) an epoxy resin having an aromatic ring in its skeleton and being of an epichlorohydrin copolymerization type, (C) an epoxy resin containing no aromatic ring in its skeleton, (D) an epoxy resin-curing catalyst, (E) an inorganic filler, and (F) a polar solvent whose boiling point is 70 to 180°C and whose surface tension at 25°C is 20 to 30 dyne/cm, in respective predetermined amounts. COPYRIGHT: (C)2011,JPO&INPIT |
