| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing liquid composition capable of reducing residue on a wafer surface and providing superior wettability on the wafer surface, and to provide a manufacturing method of semiconductor substrate using the polishing liquid composition. SOLUTION: The polishing liquid composition contains an abrasive, a hydroxyethyl cellulose and a basic compound. The hydroxyethyl cellulose is prepared by hydrolyzing the hydroxyethyl cellulose whose weight average molecular weight is 0.3-3 million. It is desirable that weight average molecular weight of the hydroxyethyl cellulose prepared by hydrolyzing is 10,000-1,800,000. Further, it is desirable that weight ratio of the abrasive and the hydroxyethyl cellulose in the polishing liquid composition (wt.% of the abrasive/wt.% of the hydroxyethyl cellulose) is 10-10,000. COPYRIGHT: (C)2011,JPO&INPIT |
