| 摘要 |
PROBLEM TO BE SOLVED: To ensure sufficient substrate cooling capability while suppressing damage to a substrate in a method for forming film using gas cooling. SOLUTION: An apparatus for forming thin film includes a cooling body 10 which is located near the back side of a substrate 7 in a thin film forming region 9 and a gas introducing means for introducing a gas between the cooling body 10 and the back side of the substrate 7. The cooling body 10 includes a transmission body which is located near the substrate and transmits infrared light and an absorber which is opposed to the substrate through the transmission body. By such a configuration, the radiant light emitted from the substrate is transmitted through the transmission body and absorbed in the absorber having high emissivity which is opposed to the substrate through the transmission body. Therefore, the radiation to the substrate 7 from the cooling body 10 can be suppressed. COPYRIGHT: (C)2011,JPO&INPIT
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