发明名称 SPUTTERING SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a sputtering system which can satisfactorily deposit a thin film on a substrate. SOLUTION: A time check is started in such a manner that a normal discharge timing previously detected by either current detection part selected from the first current detection part 15 and the second current detection part 16 is used as a trigger. To a cathode in which the normal discharge timing has been detected by the other current detection part, a time difference between the normal discharge timing detected by either current detection part and the normal discharge timing detected by the other current detection part is obtained. Then, the voltage to be applied is set in such a manner that discharge is finished at the point of time in which the time obtained by adding the time difference to a prescribed time is measured. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011058083(A) 申请公布日期 2011.03.24
申请号 JP20090211963 申请日期 2009.09.14
申请人 CANON INC 发明人 SUZUKI HITOSHI
分类号 C23C14/34 主分类号 C23C14/34
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