| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for sensing temperature on a substrate in an integrated circuit fabrication tool. SOLUTION: In the apparatus, a cable and interconnect design includes a substrate containing discrete sensors in a plurality of cavities or a plurality of thin film sensors deposited throughout the substrate surface. The discrete sensors are bonded within each cavity and potted with a potting compound. Each sensor has leads joined to filaments by an interconnect system. Thin film sensor leads on the substrate are connected with signal transmission cables by the interconnect system. The filaments are coated to be collected into a strain relief coupled to the substrate. The cable, having flat and round portions, includes an array of flat signal transmitting cables arranged side by side in the flat part and stacked one on top of the other in the round part. Each signal cable contains a plurality of filaments bonded together. A pair of ribbons extend in a longitudinal direction of the cable array. COPYRIGHT: (C)2011,JPO&INPIT
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