发明名称 DEVICE FOR HEATING OR COOLING WORKPIECE, WORKPIECE STORING MEANS AND REFLOW SOLDERING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a device capable of uniformly heating or cooling a workpiece. SOLUTION: The device for heating or cooling the workpiece at least includes a treatment container defining a storage space for storing the workpiece and a temperature control means for controlling the temperature of gas in the storage space. The treatment container includes: a heat insulating outer layer; and a heat uniformizing layer having 100 W/mK or more of thermal conductivity and arranged on the inner side from the outer layer for uniformizing temperature distribution in the storage space. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011058761(A) 申请公布日期 2011.03.24
申请号 JP20090211239 申请日期 2009.09.14
申请人 TOYOTA CENTRAL R&D LABS INC 发明人 IKUNO HAJIME
分类号 F27D1/00;F27B17/00;F27D7/02;F27D7/04;F27D9/00 主分类号 F27D1/00
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