发明名称 |
DEVICE FOR HEATING OR COOLING WORKPIECE, WORKPIECE STORING MEANS AND REFLOW SOLDERING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a device capable of uniformly heating or cooling a workpiece. SOLUTION: The device for heating or cooling the workpiece at least includes a treatment container defining a storage space for storing the workpiece and a temperature control means for controlling the temperature of gas in the storage space. The treatment container includes: a heat insulating outer layer; and a heat uniformizing layer having 100 W/mK or more of thermal conductivity and arranged on the inner side from the outer layer for uniformizing temperature distribution in the storage space. COPYRIGHT: (C)2011,JPO&INPIT
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申请公布号 |
JP2011058761(A) |
申请公布日期 |
2011.03.24 |
申请号 |
JP20090211239 |
申请日期 |
2009.09.14 |
申请人 |
TOYOTA CENTRAL R&D LABS INC |
发明人 |
IKUNO HAJIME |
分类号 |
F27D1/00;F27B17/00;F27D7/02;F27D7/04;F27D9/00 |
主分类号 |
F27D1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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