| 发明名称 |
METHOD FOR FORMING BARRIER METAL FILM |
| 摘要 |
<p>Provided is a method for forming a barrier metal film. A substrate is prepared by forming microholes or microgrooves in the surface thereof, and a barrier metal film created from titanium or a titanium compound is formed on the substrate with the substrate temperature set within the range between 150ºC and 500ºC.</p> |
| 申请公布号 |
WO2011034092(A1) |
申请公布日期 |
2011.03.24 |
| 申请号 |
WO2010JP65942 |
申请日期 |
2010.09.15 |
| 申请人 |
ULVAC, INC.;NAKANISHI SHIGEO;KODAIRA SHUJI;KAMADA KOUKICHI;HORITA KAZUMASA;HAMAGUCHI JUNICHI;YOSHIHAMA TOMOYUKI;TOYODA SATORU |
发明人 |
NAKANISHI SHIGEO;KODAIRA SHUJI;KAMADA KOUKICHI;HORITA KAZUMASA;HAMAGUCHI JUNICHI;YOSHIHAMA TOMOYUKI;TOYODA SATORU |
| 分类号 |
C23C14/34;H01L21/28;H01L21/285;H01L21/3205;H01L23/52 |
主分类号 |
C23C14/34 |
| 代理机构 |
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