发明名称 BONDING ASSEMBLING METHOD, BONDING ASSEMBLING APPARATUS, FIRST BONDING PROCESS APPARATUS, AND SECOND BONDING PROCESS APPARATUS
摘要 PROBLEM TO BE SOLVED: To ensure the fitting, by means of bonding, of a large product such as a vehicle body which requires the positioning accuracy and fitting quality of individual bonding components in bonding structures, and to secure the safety of a worker during operation. SOLUTION: The worker 104 carries a cart 103, which has a moving tool 108 and causes the moving tool 108 to hold adhesive-applied bonding components, along a rail 102 laid on a floor surface GL of a factory. The worker 104 fixes the cart 103 upward of a first bonding process apparatus 201 and bonds the bonding components to each other, for example, by sliding a fixture acting portion 209 upward. After moving the fixture acting portion 209 downward and releasing the first bonding process apparatus 201, the worker 104 carries the cart 103 upward of a second bonding process apparatus 301 and fixes the cart 103 there. The worker 104 then enters the underfloor work pit 302 and scrapes the adhesive overflowing below the bonding components via a working opening 312. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011056612(A) 申请公布日期 2011.03.24
申请号 JP20090207999 申请日期 2009.09.09
申请人 CENTRAL MOTOR CO LTD 发明人 SUZUKI HIDEAKI;OKADA SHIGEYUKI
分类号 B23P19/04;B23P21/00;B23P25/00;B62D65/00;C09J5/00 主分类号 B23P19/04
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