发明名称 PLASMA PROCESSING APPARATUS AND GAS SUPPLY MECHANISM FOR PLASMA PROCESSING APPARATUS
摘要 <p>Disclosed is a plasma processing apparatus (31) equipped with a processing container (32); a gas supply unit for plasma processing (33) that supplies gas for plasma processing within the processing container (32); a holding base (34) that holds a substrate to be processed (W) thereupon; a plasma generation mechanism (39) that generates plasma within the processing container (32); and a gas supply mechanism (61) that comprises a head section (62), which is capable of supplying gas and moving to a first position that is above the holding base (34) and to a second position that differs from the first position, and that adsorbs deposition gas upon the substrate to be processed (W) in a small-volume area that is formed between the head section (62) and the holding base (34) when the head section (62) has been disposed in the first position.</p>
申请公布号 WO2011034057(A1) 申请公布日期 2011.03.24
申请号 WO2010JP65847 申请日期 2010.09.14
申请人 TOKYO ELECTRON LIMITED;IWASAKI, MASAHIDE;NOZAWA, TOSHIHISA 发明人 IWASAKI, MASAHIDE;NOZAWA, TOSHIHISA
分类号 H01L21/31;C23C16/455;C23C16/511;H01L21/3065 主分类号 H01L21/31
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