ADHESIVE FILM, MULTILAYER CIRCUIT BOARD, ELECTRONIC COMPONENT, AND SEMICONDUCTOR DEVICE

摘要

Disclosed is an adhesive film having a composition containing (A) a thermosetting resin, (B) a hardening agent, (C) a flux activation compound, and (D) a film forming resin. The adhesive film has a minimum melt viscosity of 0.01-10,000 Pa·s and satisfies formula (1), where the exothermic peak temperature of the adhesive film is defined as (a) and the 5% mass heat loss temperature of the adhesive film is defined as (b). Formula (1): (b) - (a) ? 100°C.