发明名称 LUMINANCE INSPECTION METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To inspect how much luminance is lowered according to conditions of a pulse laser beam in the case of diving a sapphire by the formation of a modified layer by irradiation with the pulse laser beam. <P>SOLUTION: In a sapphire substrate, modified layers are formed on two first division-planned lines by pulse laser beams of a first condition and a second condition, and modified layers are formed on two second division-planned lines by a pulse laser beam of the first condition and the second condition to obtain a first light-emitting device cut out only each by the first condition and a second light-emitting device cut out only by the second condition. Each luminance of the first and second light-emitting devices is measured to determine a difference with pre-division luminance measured on each light-emitting device prior to the division of the sapphire substrate on each device and inspect the difference in luminance reduction caused by the difference of the conditions. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011058959(A) 申请公布日期 2011.03.24
申请号 JP20090209189 申请日期 2009.09.10
申请人 DISCO ABRASIVE SYST LTD 发明人 ENDO TOMOHIRO
分类号 G01M11/00;B23K26/00;B23K26/40;B28D5/00;G01R31/26;H01L21/301;H01L21/66;H01L33/00 主分类号 G01M11/00
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