| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of effectively dissipating heat of a semiconductor chip from both surface sides of a substrate while suppressing reflection and attenuation of a signal by a via. SOLUTION: The semiconductor device 1 includes a substrate 3 having a through-hole 2 formed along its thickness, the semiconductor chip 4 fixed on the substrate 3, the conductive via 5 provided in the through-hole 2 on the side of one surface 3a of the substrate 3 and electrically connected to the semiconductor chip 4, and a heat dissipating member 6 provided in the through-hole 2 on the side of the other surface 3b opposite to the one surface 3a of the substrate 3, and having an insulation property and a larger thermal conductivity than the substrate 3, the substrate 3 having a conductor layer 10 electrically connected to the via 5. COPYRIGHT: (C)2011,JPO&INPIT |
