发明名称 Printed circuit board having electromagnetic bandgap structure
摘要 Disclosed is a printed circuit board including an electromagnetic bandgap structure. The electromagnetic bandgap structure, which includes a first dielectric material for interlayer insulation and is for blocking a noise, is inserted into the printed circuit board. The electromagnetic bandgap structure can include a first conductive plate, a second conductive plate arranged on a planar surface that is different from that of the first conductive plate, a third conductive plate arranged on a same planar surface as the first conductive plate, and a stitching via unit configured to connect the first conductive plate and the third conductive plate through the planar surface on which the second conductive plate is arranged. A second dielectric material having a permittivity that is different from that of the first dielectric material is interposed between any two of the first conductive plate, the second conductive plate, and the third conductive plate.
申请公布号 US2011067917(A1) 申请公布日期 2011.03.24
申请号 US20090654526 申请日期 2009.12.22
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 PARK DAE-HYUN;KIM HAN;BONG KANG-WOOK
分类号 H05K9/00 主分类号 H05K9/00
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