发明名称 |
INDUCTIVELY COUPLED POWER MODULE AND CIRCUIT |
摘要 |
<p>Inductive coupling modules for providing power to secondary devices placed in proximity thereto on a surface are described. The modules include above-surface, flush, recessed, and sub-surface mounting configurations. The modules further include dual housing, single housing, low-profile, and adjustable configurations. Inductively coupled power distribution circuits are also disclosed. The circuits comprise a plurality of segments that are inductively couple together to eliminate wired connections between segments. Each segment may be attached to a section of a modular furniture component to allow ease and safety in rearranging the modular furniture and ease in reconnecting the circuit.</p> |
申请公布号 |
WO2011034759(A2) |
申请公布日期 |
2011.03.24 |
申请号 |
WO2010US48053 |
申请日期 |
2010.09.08 |
申请人 |
L & P PROPERTY MANAGEMENT COMPANY |
发明人 |
TURNER, JASON;JOHNSON, LEROY B.;BROWNING, CALEB;MALMBERG, JOHN |
分类号 |
H01F38/14 |
主分类号 |
H01F38/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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