发明名称 |
SUBSTRATE-CUTTING SYSTEM, SUBSTRATE-PRODUCING APPARATUS, SUBSTRATE-SCRIBING METHOD, AND SUBSTRATE-CUTTING METHOD |
摘要 |
<p>A clamping device ( 50 ) is installed on a stand ( 10 ) with a hollow rectangular parallelepiped shape such that at least one place at a side edge portion of a mother board transported in the stand ( 10 ) is clamped. A pair of substrate-cutting devices for cutting the mother substrate, clamped by the clamping device ( 50 ), from its upper face and lower face is provided on a scribing device guide body ( 30 ). The scribing device guide body ( 30 ) is reciprocally movable along one side of the hollow rectangular parallelepiped. The pair of substrate-cutting devices is installed so as to be movable along the direction perpendicular to the movement direction of the scribing device guide body ( 30 ). The mother substrate clamped by the clamping device is supported by a substrate-supporting device ( 20 ).</p> |
申请公布号 |
EP1604794(A4) |
申请公布日期 |
2011.03.23 |
申请号 |
EP20030748575 |
申请日期 |
2003.09.24 |
申请人 |
MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD. |
发明人 |
NISHIO, YOSHITAKA;OKAJIMA, YASUTOMO;OSHIMA, YUKIO;ONARI, HIROYUKI;YOSHIMOTO, KAZUHIRO |
分类号 |
B28D1/22;B28D5/00;B65G49/06;C03B33/023;C03B33/027;C03B33/03;C03B33/09;(IPC1-7):B28D5/00 |
主分类号 |
B28D1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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