METHOD FOR MANUFACTURING OF BACK CONTACT SOLAR CELLS USING PLATING

摘要

PURPOSE: A method for manufacturing a rear electrode solar cell using plating is provided to simultaneously form a base electrode and an emitter electrode by a plating method, thereby reducing the number of processes. CONSTITUTION: A plurality of holes(101) is formed on a semiconductor substrate(100). An emitter layer(103) is formed by performing doping on the semiconductor substrate. Barrier masks(105) are formed on the front side and the rear side of the semiconductor substrate and on the inner surface of a hole. An insulator(109) is formed in a part where the base electrode is formed. The hole is filled with metallic materials by using a plating method. A transparent conductive film(119) is formed on the front side of the semiconductor substrate.