ENCAPSULATION METHOD OF LIGHT EMITTING DIODE AND LIGHT EMITTING DIODE ENCAPSULATED USING SAME

摘要

PURPOSE: A method for encapsulating a light emitting diode is provided to expose and encapsulate a light emitting diode along with a pattern realized by an image without a mask, thereby increasing the production yield of light emitting diodes. CONSTITUTION: An optical semiconductor chip and a photocurable resin composition for a light emitting diode are provided to a micro fluidic tube with a fluidic rail. Light with a selected feature is irradiated to the photocurable resin composition to harden the photocurable resin composition. The optical semiconductor chip for a light emitting diode is encapsulated by the hardened photocurable resin composition. The photocurable resin composition has a light transmitting rate which is larger than 95%. The photocurable resin composition has the refractive index of 1.4 to 1.7.