| 摘要 |
PURPOSE: A semiconductor package is provided to insert a conductive connection member between semiconductor chip modules, thereby preventing a crack of a semiconductor chip by minimizing stress due to wire bonding. CONSTITUTION: A first semiconductor chip module(150) is attached to a substrate(110). A conductive connection member(160) is attached onto the first semiconductor chip module. The conductive connection member comprises a conductive plate(162), a connection member(164), and a spacer member(166). The connection member electrically connects the conductive plate with the first semiconductor chip module. A second semiconductor chip module(151) is attached onto the conductive connection member. |
