发明名称 |
SILICON CARBIDE DIMPLED SUBSTRATE |
摘要 |
A substrate is disclosed. It comprises:
a first layer having a first main surface and a second main surface opposing the first main surface;
an active layer on the first main surface of the first layer;
an array of dimples extending from the second main surface into the first layer toward the first main surface; and
a metallization layer overlying the second main surface of the first layer and within the dimples. |
申请公布号 |
EP1972008(A4) |
申请公布日期 |
2011.03.23 |
申请号 |
EP20070709682 |
申请日期 |
2007.01.10 |
申请人 |
CREE, INC. |
发明人 |
HARRIS, CHRISTOPHER;BASCERI, CEM;GEHRKE, THOMAS;BALKAS, CENGIZ |
分类号 |
H01L21/84;H01L33/00;H01L33/32;H01L33/38 |
主分类号 |
H01L21/84 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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