发明名称 STABLE, HIGH RATE SILICON SLURRY
摘要 The invention provides a chemical-mechanical polishing composition comprising wet-process silica, a stabilizer compound, a potassium salt, a secondary amine compound, and water. The invention further provides a method of polishing a substrate with the polishing composition.
申请公布号 EP2297263(A2) 申请公布日期 2011.03.23
申请号 EP20090750923 申请日期 2009.05.07
申请人 CABOT MICROELECTRONICS CORPORATION 发明人 WHITE, MICHAEL;GILLILAND, JEFFREY;JONES, LAMON;WALTERS, ALICIA
分类号 C09K3/14;C09G1/02;H01L21/02 主分类号 C09K3/14
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