A MANUFACTURING METHOD OF A THIN LAYER SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A method for manufacturing a thin layer semiconductor package is provided to remove a plasma cleaning process, thereby saving manufacturing costs by reducing the number of manufacturing processes. CONSTITUTION: A photosensitive film is formed on front and rear surfaces of a copper plate(S100). Trenches and lead frames are formed by selectively etching the photosensitive film on the copper plate(S200). Photo resist patterns are formed in the trenches respectively(S300). The photo resist patterns are removed(S600). A gold plating layer is exposed by etching the copper plate(S800).